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MOQ : 1PCS
Price : usd128/pcs
Payment Terms : T/T, Western Union
Supply Ability : 50000pcs per month
Delivery Time : 20-25 working days
Packaging Details : Anti-static bag + Anti-static bubble wrap + Good quality carton box
Place of Origin : Shenzhen, Guangdong, China
Brand Name : China chao sheng
Certification : ISO/UL/RoHS/TS
Product areas : Communication equipment products
Product structure : 6-layer
Material : FR-4, TG140
Board thickness : 1.60mm
Size : 1200*750mm/pcs
Minimum hole : 0.35mm
Minimum line width and space : 5/5mil
aspect ratio : 8:1
Surface treatment : OSP
Provide PCB information : Gberber, production requirements, MOQ quantity
PCBA information : BOM report, X, Y left plot
Copper thickness : 35um
Special large size1200*750mm, FR-4, TG170, minimum hole 0.20mm,Large PCB Prototype Board,single sided pcb board
Product Description
Our Quality processes include:
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection for every process
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO 14001:2004
Certificates:
ISO9001-2008
ISO/TS16949
UL
IPC-A-600G and IPC-A-610E Class II compliance
Customer's requirements
Quick Detail:
1. PCB Assembly on SMT and DIP
2. PCB schematic drawing/ layout /producing
3. PCBA clone/change board
4. Components sourcing and purchasing for PCBA
5. Enclosure design and plastic injection molding
6. Full range of testing services. Including: AOI, Fuction Testing , In Circuit Testing, X-Ray For BGA Testing,
7. IC programming
PCB, FPC product application field
Various digital products, automotive new energy, automotive products, military, aerospace, medical, wireless terminals, wired terminals, communication equipment, communication stations, finance, industrial industrial control, consumer electronics, educational equipment, smart devices, smart products, security, LED, computer, mobile phone and other electronic products
FAQ
Q: What files do you use in PCB fabrication?
A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position
Q: Is it possible you could offer sample?
A: Yes, we can custom you sample to test before mass production
Q: When will I get the quotation after sent Gerber, BOM and test procedure?
A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.
Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?
A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing
Q: How can I make sure the quality of my PCB?
A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.
PCB, FPC process production capability
Technical ltem | MassProduct | Advanced Technology | |||||
2016 | 2017 | 2018 | |||||
Max.Layer Count | 26L | 36L | 80L | ||||
Through-hole plate | 2~45L | 2~60L | 2~80L | ||||
Max.PCBSize(in) | 24*52" | 25*62" | 25*78.75" | ||||
The layer number of FPC | 1~36L | 1~50L | 1~60L | ||||
Max.PCBSize(in) | 9.8"*196" | 9.8"*196" | 10"*196"Reel to reel | ||||
Layeredplatelayer | 2~12L | 2~18L | 2~26L | ||||
Max.PCBSize(in) | 9"*48" | 9"*52" | 9"*62" | ||||
Combination of hard and soft layers | 3~26L | 3~30L | 3~50L | ||||
Interconnect HDI | 5+X+5Interconnect HDI | 7+X+7Interconnect HDI | 8+X+8,Interconnect HDI | ||||
HDI PCB | 4~45L | 4~60L | 4~80L | ||||
Interconnect HDI | 3+20+3 | 4+X+4Interconnect HDI | 4+X+4,Interconnect HDI | ||||
Max.PCBSize(in) | 24"*43" | 24"*49" | 25"*52" | ||||
Material | FR-4 Rogers | FR-4 Rogers | FR-4 Rogers | ||||
Base material | Halogenfree,LowDK | Halogenfree,LowDK | Halogenfree,LowDK | ||||
Build-up Material | FR-4 | FR-4 | FR-4 | ||||
BOard,Thickness(mm) | Min.12L(mm) | 0.43 | 0.42~8.0mm | 0.38~10.0mm | |||
Min.16L(mm) | 0.53 | 1.60~8.0mm | 0.45~10.0mm | ||||
Min.18L(mm) | 0.63 | 2.0~8.0 | 0.51~10.0mm | ||||
Min.52L(mm) | 0.8 | 2.50~8.0mm | 0.65~10.0mm | ||||
MAX(mm) | 3.5 | 10.0mm | 10.0mm | ||||
Min.CoreThickness um(mil) | 254"(10.0) | 254"(10.0) | 0.10~254(10.0mm) | ||||
Min.Build up Dielectric | 38(1.5) | 32(1.3) | 25(1.0) | ||||
BaseCopperWeight | Inner Layer | 4/1-8 OZ | 4/1-15 OZ | 4/1-0.30mm | |||
Out Layer | 4/1-10 OZ | 4/1-15 OZ | 4/1-30 OZ | ||||
Gold thick | 1~40u" | 1~60u" | 1~120u" | ||||
Nithick | 76~127u" | 76~200u" | 1~250u" | ||||
Min.HOle/Land um(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | ||||
Min.Laser via/landum(mil) | 60/170(2.4/6.8) | 50/150(2/6) | 50/150(2/6) | ||||
Min. IVH,Hole size/landum(mil) | 150/300(6/12) | 100/200(4/8) | 100/200(4/8) | ||||
DieletricThickness | 38(1.5) | 32(1.3) | 32(1.3) | ||||
125(5) | 125(5) | 125(5) | |||||
SKipvia | Yes | Yes | Yes | ||||
viaoNhie(laserviaon BuriedPTH) | Yes | Yes | Yes | ||||
Laser Hole Filling | Yes | Yes | Yes | ||||
Technicalltem | Mass Product | Advanced Technolgy | |||||
2017year | 2018year | 2019year | |||||
Drill hole depth ratio | ThroughHole | 2017year | .40:1 | .40:1 | |||
Aspet Ratio | Micro Via | .35:1 | 1.2:1 | 1.2:1 | |||
Copper Filling Dimple Size um(Mil) | 10(0.4) | 10(0.4) | 10(0.4) | ||||
Min.LineWidth&space | lnner Layer um(mil) | 45/45(1.8/1.8) | 38/38(1.5/1.5) | 38/38(1.5/1.5) | |||
Plated Layer um(mil) | 45/45(1.8/1.8) | 38/38(1.5/1.5) | 38/38(1.5/1.5) | ||||
BGAPitch mm(Mil) | 0.3 | 0.3 | 0.3 | ||||
Min.PTH Hole ring um(mil) | 75(3mil) | 62.5(2.5mil) | 62.5(2.5mil) | ||||
Line Width Control | ∠2.5MIL | ±0.50 | ±0.50 | ±0.50 | |||
2.5Mil≤L/W∠4mil | ±0.50 | ±0.50 | ±0.50 | ||||
≦3mil | ±0.60 | ±0.60 | ±0.60 | ||||
Laminated structure | Layer by layer | 3+N+3 | 4+N+4 | 5+N+5 | |||
Sequential Build-up | 20L Any Layer | 36L Any Layer | 52L Any Layer | ||||
Multi-layer overlay | N+N | N+N | N+N | ||||
N+X+N | N+X+N | N+X+N | |||||
sequential Lamination | 2+(N+X+N)+2 | 2+(N+X+N)+2 | 2+(N+X+N)+2 | ||||
Soft and hard bonding | 2+(N+X+N)+2 | 2+(N+X+N)+2 | 2+(N+X+N)+2 | ||||
PTH filling process | PTH resin plug hole + plating fill Electroplated hole/copper plug hole | PTH resin plug hole + plating fill Electroplated hole/copper plug hole | PTH resin plug hole + plating fill
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FR-4 TG170 Single Sided Pcb Board , Surface Mount Pcb Assembly Minimum Hole 0.20mm Images |